Senior Semiconductor Packaging Application Engineer (Thermo Compression Bonding - TCB)

The Supreme HR Advisory ยท ๐Ÿ“ Badung, Bali, Indonesia ยท Diposting 2026-10-09
FULL_TIMEโญ TERVERIFIKASI
USD 9000 - 10000

We are seeking a highly skilled and experienced Senior Semiconductor Packaging Application Engineer to join our team in Badung, Bali. This role is crucial in developing and optimizing thermo compression bonding (TCB) processes for semiconductor packaging, ensuring high-quality and reliable products.

As a Senior Semiconductor Packaging Application Engineer, you will play a key role in driving innovation and efficiency in our manufacturing processes. You will work closely with cross-functional teams to implement best practices and continuously improve our production capabilities.

If you are passionate about semiconductor technology and have a proven track record in TCB processes, we encourage you to apply for this exciting opportunity.

๐Ÿ“‹ Tanggung Jawab Pekerjaan

Tanggung Jawab:

๐ŸŽ“ Kualifikasi & Syarat

Kualifikasi:

๐Ÿ› ๏ธ Keahlian

Semiconductor PackagingThermo Compression BondingProcess DevelopmentProcess ValidationData AnalysisTechnical SupportIndustry StandardsContinuous Improvement
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