Senior Semiconductor Packaging Application Engineer (Thermo Compression Bonding - TCB)
The Supreme HR Advisory ยท ๐ Badung, Bali, Indonesia ยท Diposting 2026-10-09
FULL_TIMEโญ TERVERIFIKASI
USD 9000 - 10000
We are seeking a highly skilled and experienced Senior Semiconductor Packaging Application Engineer to join our team in Badung, Bali. This role is crucial in developing and optimizing thermo compression bonding (TCB) processes for semiconductor packaging, ensuring high-quality and reliable products.
As a Senior Semiconductor Packaging Application Engineer, you will play a key role in driving innovation and efficiency in our manufacturing processes. You will work closely with cross-functional teams to implement best practices and continuously improve our production capabilities.
If you are passionate about semiconductor technology and have a proven track record in TCB processes, we encourage you to apply for this exciting opportunity.
๐ Tanggung Jawab Pekerjaan
Tanggung Jawab:
- Develop and optimize thermo compression bonding (TCB) processes for semiconductor packaging.
- Conduct process validation and characterization to ensure product quality and reliability.
- Collaborate with cross-functional teams to implement process improvements and best practices.
- Monitor and analyze production data to identify areas for improvement.
- Develop and maintain standard operating procedures (SOPs) for TCB processes.
- Provide technical support and training to team members.
- Stay updated with industry trends and emerging technologies in semiconductor packaging.
- Participate in project planning and execution to meet production targets.
๐ Kualifikasi & Syarat
Kualifikasi:
- Bachelor's degree in Materials Science, Chemical Engineering, or related field.
- Minimum of 5 years of experience in semiconductor packaging, with a focus on TCB processes.
- Strong understanding of semiconductor manufacturing processes and materials.
- Proven experience in process development, optimization, and validation.
- Excellent analytical and problem-solving skills.
- Strong communication and teamwork abilities.
- Proficiency in English, both written and spoken.
- Familiarity with relevant industry standards and regulations.
๐ ๏ธ Keahlian
Semiconductor PackagingThermo Compression BondingProcess DevelopmentProcess ValidationData AnalysisTechnical SupportIndustry StandardsContinuous Improvement
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